Formation of composite nanostructures by corrosive deposition of copper into porous silicon
Author:
Publisher
Elsevier BV
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
Reference6 articles.
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1. Fabrication and Magnetic Properties of N-type Porous Silicon/Nickel Microtubes Composite;Journal of Inorganic Materials;2016
2. Filling of porous silicon with magnetic materials;Semiconductor Science and Technology;2015-10-01
3. Electric Field Enhancement in 3-D Tapered Helix Antenna for Terahertz Applications;IEEE Transactions on Terahertz Science and Technology;2014-05
4. Enhancement of Cu Filling into p-Type Macro-Porous Silicon by Pore Wall Thinning, Oxide Deposition and Back Side Illumination;Journal of The Electrochemical Society;2014
5. Comparative study of initial stages of copper immersion deposition on bulk and porous silicon;Nanoscale Research Letters;2013-02-15
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