3D integration technologies for imaging applications-Reference-Cited by-同舟云学术

3D integration technologies for imaging applications

Published:2008-06 Issue:1 Volume:591 Page:224-228
ISSN:0168-9002
Container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
language:en
Short-container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Author:

De Moor Piet

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Reference15 articles.

1. See for a broad overview the book Fundamentals of Microfabrication, by Marc J. Madou, CRC Press.

2. Optimization of design and technology for uncooled poly-SiGe microbolometer arrays

3. A reliable and compact polymer-based package for capacitive RF-MEMS switches;Oya,2004

4. Koen De Munck, et al., Wafer level temporary bonding/debonding for thin wafer handling applications, in: IMAPS International Conference and Exhibition on Device Packaging, Scottsdale, March 2006.

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