3D active edge silicon sensors: Device processing, yield and QA for the ATLAS-IBL production

Author:

Da Vià Cinzia,Boscardil Maurizio,Dalla Betta GianFranco,Darbo Giovanni,Fleta Celeste,Gemme Claudia,Giacomini Gabriele,Grenier Philippe,Grinstein Sebastian,Hansen Thor-Erik,Hasi Jasmine,Kenney Christopher,Kok Angela,La Rosa Alessandro,Micelli Andrea,Parker Sherwood,Pellegrini Giulio,Pohl David-Leon,Povoli Marco,Vianello Elisa,Zorzi Nicola,Watts S.J.

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Reference12 articles.

1. M. Capeans, et al., ATLAS Insertable B-Layer Technical Design Report, CERNLHCC-2010-013; ATLAS-TDR-019. 〈http://cdsweb.cern.ch/record/1291633?ln=en〉.

2. AFP, CERN Document Server, ATL-LUM-SLIDE-2009-088; ATL-COM-LUM-2009-007.

3. Silicon detectors with 3-D electrode arrays: fabrication and initial test results

4. Stanford Nanofabrication Facility Stanford University, School of Engineering, Stanford, CA 94305-4070, USA. 〈http://snf.stanford.edu/〉.

5. A. Kok, et al., Results from the first prototype of large 3D active edge sensors, 2011 IEEE NSS, Conference Record, Paper N24-5.SINTEF MiNaLab, Gaustadalleen 23C, 0373 Oslo, Norway. 〈http://www.sintef.no/microsystems〉.

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