Embedded pitch adapters: A high-yield interconnection solution for strip sensors

Author:

Ullán M.,Allport P.P.,Baca M.,Broughton J.,Chisholm A.,Nikolopoulos K.,Pyatt S.,Thomas J.P.,Wilson J.A.,Kierstead J.,Kuczewski P.,Lynn D.,Hommels L.B.A.,Fleta C.,Fernandez-Tejero J.,Quirion D.,Bloch I.,Díez S.,Gregor I.M.,Lohwasser K.,Poley L.,Tackmann K.,Hauser M.,Jakobs K.,Kuehn S.,Mahboubi K.,Mori R.,Parzefall U.,Clark A.,Ferrere D.,Gonzalez Sevilla S.,Ashby J.,Blue A.,Bates R.,Buttar C.,Doherty F.,McMullen T.,McEwan F.,O'Shea V.,Kamada S.,Yamamura K.,Ikegami Y.,Nakamura K.,Takubo Y.,Unno Y.,Takashima R.,Chilingarov A.,Fox H.,Affolder A.A.,Casse G.,Dervan P.,Forshaw D.,Greenall A.,Wonsak S.,Wormald M.,Cindro V.,Kramberger G.,Mandić I.,Mikuž M.,Gorelov I.,Hoeferkamp M.,Palni P.,Seidel S.,Taylor A.,Toms K.,Wang R.,Hessey N.P.,Valencic N.,Hanagaki K.,Dolezal Z.,Kodys P.,Bohm J.,Mikestikova M.,Bevan A.,Beck G.,Milke C.,Domingo M.,Fadeyev V.,Galloway Z.,Hibbard-Lubow D.,Liang Z.,Sadrozinski H.F.-W.,Seiden A.,To K.,French R.,Hodgson P.,Marin-Reyes H.,Parker K.,Jinnouchi O.,Hara K.,Bernabeu J.,Civera J.V.,Garcia C.,Lacasta C.,Marti i Garcia S.,Rodriguez D.,Santoyo D.,Solaz C.,Soldevila U.

Funder

Ministry of Education, Youth and Sports of the Czech Republic

German Federal Ministry of Education and Research

Helmholtz Association

European Social Fund

Ministry of Science, Research and Arts, Baden-Wuerttemberg, Germany

Japan Society for Promoting Science KAKENHI-A

KAKENHI-C

Ministry of Education, Culture, Sports, Science and Technology-Japan

KAKENHI for Research on Priority Area

Scientific Research on Innovative Areas

Slovenian Research Agency

Spanish Ministry of Economy and Competitiveness through the Particle Physics National Program

FEDER

State Secretariat for Education, Research, and Innovation

Swiss National Science Foundation

Canton of Geneva, Switzerland

UK Science and Technology Facilities Council

United States Department of Energy

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Reference15 articles.

1. High-pitch petal-on-glass technology for pad pitch adaptation between detectors and readout electronics;Ullan;IEEE Trans. Nucl. Sci.,2004

2. C. Lacasta, Presentation at the ATLAS Upgrade Week (AUW), CERN, Switzerland, Feb 2009.

3. Silicon strip staves and petals for the ATLAS Upgrade tracker of the HL-LHC;Díez.;Nucl. Instrum. Methods Phys. Res. Sect. A,2013

4. V. Benitez, et al. Sensors for the End-cap prototype of the Inner Tracker in the ATLAS detector upgrade, TL-COM-UPGRADE-2015-027, CERN, 2015.

5. A forward silicon strip system for the ATLAS HL-LHC upgrade;Aliev;Nucl. Instrum. Methods Phys. Res. Sect. A,2013

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1. Testbeam studies on pick-up in sensors with embedded pitch adapters;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2019-04

2. Prototyping of petalets for the Phase-II upgrade of the silicon strip tracking detector of the ATLAS experiment;Journal of Instrumentation;2018-03-22

3. Signal coupling to embedded pitch adapters in silicon sensors;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2018-01

4. Prototyping of hybrids and modules for the forward silicon strip tracking detector for the ATLAS Phase-II upgrade;Journal of Instrumentation;2017-05-18

5. Sensors for the End-cap prototype of the Inner Tracker in the ATLAS Detector Upgrade;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2016-10

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