Wire-bond failures induced by resonant vibrations in the CDF silicon detector-Reference-Cited by-同舟云学术

Wire-bond failures induced by resonant vibrations in the CDF silicon detector

Published:2004-02 Issue:1-2 Volume:518 Page:277-280
ISSN:0168-9002
Container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
language:en
Short-container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Author:

Bolla G.,Atac M.,Pavlicek V.,Nahn S.,Garcia-Sciveres M.,Mumford R.,Nguyen T.,Forrester S.,Hill C.,Olszewski J.,Rahaman A.,Goldstein J.,Ashmanskas B.,Maruyama T.,Zimmerman T.,Moccia S.,Lewis J.

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Reference5 articles.

1. The SVX II silicon vertex detector upgrade at CDF

2. Readout electronics architecture and packaging for the CDF silicon upgrade

3. SVX3: A deadtimeless readout chip for silicon strip detectors

4. The SVX3D integrated circuit for dead-timeless silicon strip readout

5. Fabrication of Passive Components for High Temperature Instrumentation

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