Fully tileable photodiode matrix for medical imaging by using through-wafer interconnects-Reference-Cited by-同舟云学术

Fully tileable photodiode matrix for medical imaging by using through-wafer interconnects

Published:2007-10 Issue:2 Volume:580 Page:1000-1003
ISSN:0168-9002
Container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
language:en
Short-container-title:Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Author:

Juntunen Mikko,Ji Fan,Henttinen Kimmo,Luusua Ismo,Hietanen Iiro,Eränen Simo

Publisher

Elsevier BV

Subject

Instrumentation,Nuclear and High Energy Physics

Reference3 articles.

1. F. Ji, S. Leppävuori, I. Luusua, K. Henttinen, S. Eränen, I. Hietanen, M. Juntunen, Fabrication of silicon based through-wafer interconnects for advanced chip scale packaging, to be published in: Eurosensors XX 2006 Conference Proceedings, vol. 1, Gothenburg, Sweden, 2006, pp. 188–189.

2. Process compatible polysilicon-based electrical through-wafer interconnects in silicon substrates

3. I. Luusua, K. Henttinen, P. Pekko, T. Vehmas, H. Luoto, Through-Wafer Polysilicon Interconnect Fabrication with In-Situ Boron Doping; in: Symposium Journal of MRS Spring Meeting Proceedings, vol. 872, spring 2005, p. J5.5.

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1. Upside down T-shape through-wafer interconnects for fully tileable photodiode matrix for medical CT imaging;Sensors and Actuators A: Physical;2012-09

2. Via-in-pixel design of truly 2D extendable photodiode detector for medical CT imaging;Sensors and Actuators A: Physical;2008-07