On the impact of nanotopography of silicon wafers on post-CMP oxide layers-Reference-Cited by-同舟云学术

On the impact of nanotopography of silicon wafers on post-CMP oxide layers

Published:2002-08 Issue:4-5 Volume:5 Page:413-418
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Schmolke R,Deters R,Thieme P,Pech R,Schwenk H,Diakourakis G

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference10 articles.

1. Acceptor Compensation in Silicon Induced by Chemomechanical Polishing

2. Gräf D, Schnegg A, Schmolke R, Suhren M, Gerber HA, Wagner P. In: Ali I, Raghavan S, editors. Chemical mechanical planarization in IC device manufacturing, Proceedings, vol. 96-22. Pennington, NJ: The Electrochemical Society Proceedings Series, 1996. p. 186.

3. Grenville A, Coombs B, Hutchinson J, Kuhn K, Miller D, Troccolo P. In: Progler CJ, editor. Optical microlithography XIII, SPIE Proceedings, vol. 4000. Bellingham, WA: Society of Photo-Optical Instrumentation Engineers, 2000. p. 452.

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