Doubleside polishing—a technology mandatory for 300mm wafer manufacturing-Reference-Cited by-同舟云学术

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Doubleside polishing—a technology mandatory for 300mm wafer manufacturing

Published:2002-08 Issue:4-5 Volume:5 Page:375-380
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Wenski G,Altmann T,Winkler W,Heier G,Hölker G

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference8 articles.

1. Jackson KA, Schröter W, editors. Handbook of semiconductor technology, vol. 2. Weinheim: Wiley, 1999. p. 1–66.

2. Brehm G, et al. EP 208 315 B1, 1987.

3. Hashimoto S, et al. US 6,180,423 B1, 2001.

4. Lee KH, et al. US 6,315,641 B1, 2001.

5. Wenski G, et al. DE 101 32 504 C1, 2002.

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1. Changes in edge shape during silicon wafer polishing: Roll-off and roll-up formation;CIRP Annals;2024

2. Manufacturing Equipment for Silicon Wafer;Handbook of Integrated Circuit Industry;2023-11-28

3. Experimental and numerical analysis of wafer-to-wafer uniformity in double-sided polishing;Precision Engineering;2023-07

4. Polishing pad design for uniform removal distributions in double-sided polishing;CIRP Annals;2023

5. Kinematic analysis of double-sided polishing of silicon wafers for improving surface flatness;Procedia CIRP;2023

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