Creep deformation of restorative resin-composites intended for bulk-fill placement
Author:
Publisher
Elsevier BV
Subject
Mechanics of Materials,General Dentistry,General Materials Science
Reference49 articles.
1. Dental technique—restorations with resin-based, bulk fill composites;Jose-Luis;AEGIS Communications,2010
2. A survey of output intensity and potential for depth of cure among light-curing units in clinical use;Pilo;Journal of Dentistry,1999
3. Hardness comparison of bulk-filled/transtooth and incremental-filled/occlusally irradiated composite resins;Lazarchik;Journal of Prosthetic Dentistry,2007
4. Influence of placement techniques on Vickers and Knoop hardness of class ii composite resin restorations;Poskus;Dental Materials,2004
5. Fracture toughness of posterior composite resins fabricated by incremental layering;Kovarik;The Journal of Prosthetic Dentistry,1993
Cited by 83 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. The effect of water storage on nanoindentation creep of various CAD-CAM composite blocks;BMC Oral Health;2023-08-07
2. Comparative Evaluation of Surface Roughness and Microhardness of Bulk-fill Composite Placed in Artificial Saliva at Three Different pH;World Journal of Dentistry;2023-06-02
3. Mechanical and Biomimetic Characteristics of Bulk-Fill Resin Dental Composites Following Exposure in a Simulated Acidic Oral Environment;Biomimetics;2023-01-04
4. Longevity of Posterior Composite Restorations and Their Reasons for Failure: A Systematic Review;Archives of Pharmacy Practice;2023
5. Effect of thickness on the degree of conversion, monomer elution, depth of cure and cytotoxicity of bulk-fill composites;Journal of Oral Science;2023
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3