Influence of LED irradiance on flexural properties and Vickers hardness of resin-based composite materials
Author:
Publisher
Elsevier BV
Subject
Mechanics of Materials,General Dentistry,General Materials Science
Reference29 articles.
1. Light-emitting diode curing light irradiance and polymerization of resin-based composite;Aravamudham;J Am Dent Assoc,2006
2. Performance of two blue light emitting-diode dental light curing units with distance and irradiation-time;Bennett;Dent Mater,2004
3. Light-emitting diode (LED) polymerisation of dental composites: flexural properties polymerisation potential;Stahl;Biomaterials,2000
4. Dental composite depth of cure with halogen and blue light emitting diode technology;Mills;Br Dent J,1999
5. Visible light resin-curing generators: a comparison;Pollock;Gen Dent,1991
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