Histomorphologic characterization and bond strength evaluation of caries-affected dentin/resin interfaces: Effects of long-term water exposure
Author:
Publisher
Elsevier BV
Subject
Mechanics of Materials,General Dentistry,General Materials Science
Reference37 articles.
1. The role of acrylophosphonic acid monomers in the formation of hybrid layers based on self-etch adhesives;Bayle;J Dent,2007
2. Effects of etching time of primary dentin on interface morphology and microtensile bond strength;Bolaños-Carmona;Dent Mater,2006
3. A challenge to the conventional wisdom that simultaneous etching and resin infiltration always occurs in self-etch adhesives;Carvalho;Biomaterials,2005
4. Durability of resin-dentin bonds related to water and oil storage;Carrilho;Am J Dent,2005
5. Microtensile bond strength of total-etch and self-etching adhesives to caries-affected dentine;Ceballos;J Dent,2003
Cited by 93 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. The Effect Of Different Caries Removal Methods On The Surface Hardness and Micro-tensile Bond Strength;Current Research in Dental Sciences;2024-07-28
2. Polymer-induced liquid precursors: How are they being used and what is the effect on dentin remineralization? A scoping review;Journal of Bioactive and Compatible Polymers;2023-12-06
3. Mechanical properties of simulated dentin caries treated with metal cations and l-ascorbic acid 2-phosphate;Odontology;2023-11-17
4. Enhanced Bonding to Caries-Affected Dentin Using an Isocyanate-Based Primer;Journal of Dental Research;2023-11-10
5. Bioactive Restorative Materials Applied over Coronal Dentine—A Bibliometric and Critical Review;Bioengineering;2023-06-19
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3