Effect of pulse-width-modulated LED light on the temperature change of composite in tooth cavities
Author:
Funder
Ministry of Education
Publisher
Elsevier BV
Subject
Mechanics of Materials,General Dentistry,General Materials Science
Reference29 articles.
1. Cure performance of light-activated composites by differential thermal analysis (DTA);McCabe;Dent Mater,1985
2. Temperature rises produced by light sources and composites during curing;Lloyd;Dent Mater,1986
3. Temperature rise during polymerization of visible light-activated composite resins;Masutani;Dent Mater,1988
4. In-vitro pulp chamber temperature rise during composite resin polymerization with various light-curing sources;Hannig;Dent Mater,1999
5. Temperature excursions at the pulp–dentin junction during the curing of light-activated dental restorations;Jakubinek;Dent Mater,2008
Cited by 19 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effect of Light Irradiance and Curing Duration on Degree of Conversion of Dual-Cure Resin Core in Various Cavities with Different Depths and Diameters;Materials;2024-09-02
2. Effect of Rapid High-Intensity Light-Curing on Increasing Transdentinal Temperature and Cell Viability: An In Vitro Study;Polymers;2024-05-22
3. Three methods to measure the photopolymerization kinetics for different radiant emittance and composite type;Dental Materials Journal;2024-03-25
4. Power management of lighting loads combined with green building integrated photovoltaics as a solution for developing more sustainable and smarter cities;Optik;2024-03
5. Temperature rise in photopolymerized adhesively-bonded resin composite: A thermography study;Dental Materials;2023-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3