Endoscopic suturing for GI applications: initial results from a prospective multicenter European registry

Author:

Maselli Roberta,Palma Rossella,Traina Mario,Granata Antonino,Juzgado Diego,Bisello Marco,Neuhaus Horst,Beyna Torsten,Bansi Davinder,Flor Laura,Bhandari Pradeep,Abdelrahim Mo,Haji Amyn,Haidry Rehan,Repici Alessandro

Publisher

Elsevier BV

Subject

Gastroenterology,Radiology, Nuclear Medicine and imaging

Reference37 articles.

1. Current status and future perspectives of endoscopic full-thickness resection;Mori;Dig Endosc,2018

2. Mini-invasive treatment of sump syndrome: OverStitch choledochoduodenostomy revision;Granata;Endoscopy,2019

3. GE port. The usefulness of an endoscopic overstitch suturing system for managing anastomotic dehiscence—a case report;Patil;J Gastroenterol,2020

4. Endoscopic suturing device with Overstitch for esophageal stent fixation;Li;Dig Endosc,2019

5. Successful anti-reflux treatment post-esophagectomy using endoscopic suturing with Overstitch;Li;Dig Endosc,2019

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