Latest progress on refractory high entropy alloys: Composition, fabrication, post processing, performance, simulation and prospect
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
General Medicine
Reference188 articles.
1. New opportunities in refractory alloys;Philips;Metall Mater Trans A.,2020
2. Microstructural development in equiatomic multicomponent alloys;Cantor;Mater. Sci. Eng. A,2004
3. Nanostructured high-entropy alloys with multiple principal elements: novel alloy design concepts and outcomes;Yeh;Adv. Eng. Mater.,2004
4. Recent progress in high-entropy alloys;Yeh;Ann. Chim. Sci. Mater.,2006
5. Refractory high-entropy alloys;Senkov;Intermetallics.,2010
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1. Effect of Cr addition on the microstructure and mechanical properties of MoNbVTa0.5Crx refractory high-entropy alloys;International Journal of Refractory Metals and Hard Materials;2024-11
2. High temperature phase transformation and mechanical properties of Hf0.25NbTa0.25TiZr high-entropy alloys formed by laser melting deposition(LMD);Materials Science and Engineering: A;2024-10
3. Investigating the influence of graphene coating thickness on Al0.3CoCrFeNi high-entropy alloy using molecular dynamics simulation;Surface and Coatings Technology;2024-10
4. Microstructure-dependent nanoindentation deformation behavior of TaTiZrV refractory high-entropy alloy;International Journal of Refractory Metals and Hard Materials;2024-09
5. Tailoring the strengthening mechanisms of high-entropy alloys toward excellent strength-ductility synergy by metalloid silicon alloying: A review;Progress in Materials Science;2024-08
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