Sinter-ability of nanocrystalline tungsten powder
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference24 articles.
1. Structure and properties of engineering alloys;Smith,1993
2. Influence of microstructure on the sintering process in crystalline metal powders investigated by positron lifetime spectroscopy: II. Tungsten powders with different powder-particle sizes;Staab;J Phys: Condens Matter,1999
3. Tungsten-properties, chemistry, technology of the element, alloys, and chemical compounds;Lassner,1999
4. Correlation between the temperature distribution and the structure of resistance sintered tungsten bars;Trzaska;Int J Refract Met H,1996
5. AKS doped tungsten wires-investigated by electrical measurements: II. Impurities in tungsten;Uray;Int J Refract Met H,2002
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