Recent progress in development of tungsten-copper composites: Fabrication, modification and applications
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference121 articles.
1. High density tungsten–copper liquid phase sintering composites from co-reduced oxide powders;Sebastian;Int. J. Powder Metall.,1979
2. Improvement of machinability of tungsten by copper infiltration technique;Das;Int. J. Refract. Met. Hard Mater.,2008
3. From solid solutions to fully phase separated interpenetrating networks in sputter deposited “immiscible” W–Cu thin films;Vüllers;Acta Mater.,2015
4. Metastable crystalline and amorphous structures formed in the Cu–W system by vapor deposition;Rizzo;MTA,1993
5. Structure, thermodynamic, and mechanical properties of WCu solid solutions;Liang;J. Phys. Chem. Solids,2017
Cited by 128 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Current-carrying tribological behavior and wear mechanism of CuW composites with different W content;Tribology International;2024-12
2. Exploration of pretreatment process and wettability of high bonding Ni-P coatings on W-Cu composites for electronic packaging;Applied Surface Science;2024-11
3. Processing of fully dense and high conductivity W 20Cu composite via copper melt infiltration into a pressed tungsten wire skeleton;International Journal of Refractory Metals and Hard Materials;2024-11
4. Strong and ductile bicontinuous Cu-RHEA composites formed by liquid metal dealloying;Materials Science and Engineering: A;2024-11
5. Effects of raw materials on microstructure and mechanical properties of second phase particles reinforced W Re composites;International Journal of Refractory Metals and Hard Materials;2024-11
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3