Thickness optimization of a multilayered structure on the coupling surface between a structure and an acoustic cavity
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Acoustics and Ultrasonics,Condensed Matter Physics
Reference31 articles.
1. An investigation concerning optimal design of solid elastic plates;Cheng;International Journal of Solids and Structures,1981
2. Topology optimization of continuum structures: a review;Eschenauer;Applied Mechanics Reviews,2001
3. On the modelling of ribbed plates for shape optimization;Soto;Structural Optimization,1993
4. A new formulation of the problem of optimum reinforcement of Reissner–Mindlin plates;Díaz;Computer Methods in Applied Mechanics and Engineering,1995
5. Optimum topology and reinforcement design of disk and plate structures with multiple stiffness and eigenfrequency;Krog;Computers and Structures,1999
Cited by 26 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effect of damping distribution on coupling in panel–cavity systems: Conditions for optimality through a modal approach;International Journal of Mechanical Sciences;2020-12
2. Acoustic impedance sensitivity approach for defining absorbing material layout using the wave based method;Journal of Sound and Vibration;2020-09
3. Comments on the validity of transfer matrix based models for the prediction of the effect of curved sound packages;Journal of Sound and Vibration;2020-01
4. An acoustic trade-off chart for the design of multilayer acoustic packages;Applied Acoustics;2019-05
5. Topology optimization of acoustic mechanical interaction problems: a comparative review;Structural and Multidisciplinary Optimization;2019-03-27
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3