Vibroacoustic topology optimization for sound transmission minimization through sandwich structures
Author:
Funder
Villum Fonden
Fonds Wetenschappelijk Onderzoek
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Acoustics and Ultrasonics,Condensed Matter Physics
Reference48 articles.
1. Dynamics of phononic materials and structures: Historical origins, recent progress, and future outlook;Hussein;Appl. Mech. Rev.,2014
2. Über die quantenmechanik der elektronen in kristallgittern;Bloch;Z. Phys.,1929
3. Sound and Structural Vibration: Radiation, Transmission and Response;Fahy,2007
4. Sandwich structures;Vinson;Appl. Mech. Rev.,2001
5. Mechanical and acoustic performance of sandwich panels with hybrid cellular cores;Li;J. Vibr. Acoust.,2018
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