Peel resistance characterization of localized polymer film bonding via thin film adhesive thermally activated by scanned CO2 laser-Reference-Cited by-同舟云学术

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Peel resistance characterization of localized polymer film bonding via thin film adhesive thermally activated by scanned CO2 laser

Published:2013-06 Issue: Volume:48 Page:358-365
ISSN:0030-3992
Container-title:Optics & Laser Technology
language:en
Short-container-title:Optics & Laser Technology

Author:

Dowding Colin,Dowding Robert,Griffiths Jonathan,Lawrence Jonathan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Heat sealing technology and engineering for packaging: principles and applications;Hishinuma,2009

2. Patterns of intakes of packaged foods in Irish children aged 5–12 years;Duffy;Food Additives and Contaminants,2006

3. Reliable and versatile performance for easy-open packaging;Promotional material,2010

4. FS910 thermoforming machine;Promotional material,2012

5. Food packaging technology;Coles,2003

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1. Comparison of the effects of femtosecond and nanosecond laser tailoring on the bonding performance of the heterojunction between PEEK/CFRP and Al–Li alloy;International Journal of Adhesion and Adhesives;2023-08

2. Laser sealing of compostable packaging solutions: Experimental approach and adhesion mechanisms;Optics and Lasers in Engineering;2021-02

3. Effect of infrared laser surface treatment on the microstructure and properties of adhesively CFRP bonded joints;Optics & Laser Technology;2018-10

4. Optimization of process parameters in laser transmission welding for food packaging applications;Procedia CIRP;2018

5. Laser sealing of dissimilar polymers for manufacturing packaging products;Journal of Laser Applications;2016-05

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