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Controllable laser thermal cleavage of sapphire wafers

  • Published:2018-03 Issue: Volume:102 Page:26-33
  • ISSN:0143-8166
  • Container-title:Optics and Lasers in Engineering
  • language:en
  • Short-container-title:Optics and Lasers in Engineering

Author:

Xu Jiayu,Hu Hong,Zhuang Changhui,Ma Guodong,Han Junlong,Lei Yulin

Funder

National Natural Science Foundation of China

(NSFC)

Shenzhen Government Research Foundation

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Fabrication methods for the manufacture of sapphire microparts;Allen;Microsyst. Technol.,2012

2. Dicing of hard and brittle materials with on-machine laser-dressed metal-bonded diamond blades;Witzendorff;Precision Eng.,2014

3. Large volume ablation of sapphire with ultra-short laser pulses;Shamir;Appl. Surf. Sci.,2013

4. GaN-based light-emitting diodes prepared with shifted laser stealth dicing;Chang;J. Display Technol.,2016

5. Effect of thermal stresses on chip-free diode laser cutting of glass;Nisar;Opt. Laser Technol.,2009

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