Author:
Solchenbach Tobias,Plapper Peter
Subject
Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference25 articles.
1. Structural applications of intermetallic compounds;Westbrook,2000
2. Effect of annealing on the interfacial structure of aluminum–copper joints;Chen;Materials Transactions,2007
3. Reliability of power connections;Braunovic;Journal of Zhejiang University,2007
4. Growth rate of intermetallic compounds in Al Cu bimetal produced by cold roll welding process;Abbasi;Journal of Alloys and Compounds,2001
5. Schweissen von Werkstoffkombinationen;Pohle,1999
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