Realization of high sensitivity displacement field from moiré interferometer with rough phase shifting mechanism and pattern matching technique-Reference-Cited by-同舟云学术

Realization of high sensitivity displacement field from moiré interferometer with rough phase shifting mechanism and pattern matching technique

Published:2005-06 Issue:6 Volume:43 Page:721-736
ISSN:0143-8166
Container-title:Optics and Lasers in Engineering
language:en
Short-container-title:Optics and Lasers in Engineering

Author:

Yang Se Young,Lee Soon-Bok

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. Solder ball connect(SBC) assemblies under thermal loading;Guo;Res Develop,1993

2. Liu S, et al., Resolving Displacement Field of Solder Ball in Flip-Chip Package by Both Phase Shifting Moiré Interferometry and FEM Modeling, Proceedings of the 48th Electronic Components and Technology Conference ECTC’98, 1998. p. 1345–53.

3. Development in optical methods for reliability analysis in electronic packaging applications;Guo;ASME J Electron Pack,1998

4. Keser B, et al., Encapsulated double-bump WL-CSP: design and reliability, Proceedings of the 51st Electronic Components and Technology Conference ECTC’01, 2001. p. 35–9.

5. Chen B, et al., Moiré Interferometer, Assist in Electronic Packaging Development. Advanced Packaging, Sep. 1999:44–50.

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