Full-field vibration amplitude recovery from high-resolution time-averaged speckle interferograms and digital holograms by regional inverting of the Bessel function-Reference-Cited by-同舟云学术

Full-field vibration amplitude recovery from high-resolution time-averaged speckle interferograms and digital holograms by regional inverting of the Bessel function

Published:2006-08 Issue:8 Volume:44 Page:747-770
ISSN:0143-8166
Container-title:Optics and Lasers in Engineering
language:en
Short-container-title:Optics and Lasers in Engineering

Author:

Borza Dan N.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. Vibration measurement using phase shifting TV-holography and digital image processing;Vikhagen;Opt Commun,1989

2. Stepped-amplitude modulation interferometry—a new real-time mechanical vibrations measurement technique;Borza,2000

3. A new interferometric method for vibration measurement by electronic holography;Borza;Exp Mech,2002

4. High-resolution time-average electronic holography for vibration measurement;Borza;Opt Las Eng,2003

5. Measurement of vibration patterns using electro-optic holography;Pryputniewicz;Proc SPIE,1989

Cited by 33 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Areal measurement of vibration modes of a hemispherical shell resonator by deflectometry;Applied Optics;2022-05-26

2. Use of laser speckle shearing interferometric vibration measurement system for acoustic-to-seismic landmine detection;Optical Engineering;2021-08-12

3. Full-field vibration profilometry using time-averaged interference microscopy aided by variational analysis;Optics Express;2020-01-02

4. Absolute and pixel-wise measurements of vibration amplitudes using time-averaged digital holography;Optics and Lasers in Engineering;2019-10

5. Comparison of algorithms determining sign of Bessel function in time averaging interferometry;Optical Measurement Systems for Industrial Inspection XI;2019-06-21