1. Eustice, A. L., Horowitz, S. J., Stewart, J. J., Travis, A. R. and Sawhillm H. T. Low temperature co-fireable ceramics: a new approach for electronic packaging. In Proceedings of the 36th Electronic Components Conference, ed. unknown. IEEE New York, Seattle, 1986, pp. 37–47.
2. RF-design considerations for passive elements in LTCC material systems;Müller;International Journal of Microcircuits and Electronic Packaging,1995
3. Low K, low loss, low fire tape system for microwave applications;Feingold,2000
4. Realisation of RF band-pass filters in an LTCC module structure;Lahti,2000
5. Gravure-offset-printing technique for the fabrication of solid films;Lahti;Applied Surface Science,1999