Ti-Nb-Cu Stress Buffer Layer for TiC Cermet/304 Stainless Steel Diffusion Bonding
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference18 articles.
1. Intermetallics/Ceramic Matrix Composite[M];Sun,2002
2. Diffusion bonding of aluminium oxide to stainless steel using stress relief interlayers
3. Finite-element analysis of residual stresses in Al2O3–TiC/W18Cr4V diffusion bonded joints
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3. Flash sintering of 3YSZ and in-situ joining with 304 stainless steel using copper as an interlayer;Scripta Materialia;2021-03
4. Diffusion Bonding and Transient Liquid Phase (TLP) Bonding of Type 304 and 316 Austenitic Stainless Steel—A Review of Similar and Dissimilar Material Joints;Metals;2020-05-08
5. Diffusion welding of stainless steel 304L/Monel K-500 composite materials produced with different methods;Advanced Composites Letters;2020-01-01
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