Vacuum Diffusion Bonding and Interfacial Structure in Ta/Cu Couple-Reference-Cited by-同舟云学术

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Vacuum Diffusion Bonding and Interfacial Structure in Ta/Cu Couple

Published:2013-09 Issue:9 Volume:42 Page:1785-1789
ISSN:1875-5372
Container-title:Rare Metal Materials and Engineering
language:en
Short-container-title:Rare Metal Materials and Engineering

Author:

Fangming Zhou,Fuqiang Zhang,Feiyuan Song,Guipeng Li,Lei Tong

Publisher

Elsevier BV

Subject

General Medicine

Reference10 articles.

1. Yao Lijun, Wang Xueze, Liu Qing. China Patent, CN101518851A[P]. 2009(in Chinese).

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Effects of the beam offset on microstructure and properties of electron beam welded tantalum and Inconel 718 joints;Materials Research Express;2021-04-01

3. Microstructure and mechanical properties of laser high-velocity impact welded Ta/Cu joints;Journal of Adhesion Science and Technology;2020-04-29

4. Direct diffusion bonding of immiscible tungsten and copper at temperature close to Copper's melting point;Materials & Design;2018-01

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