Thermodynamic Study of Sn-Ag-Ti Active Filler Metals-Reference-Cited by-同舟云学术

Thermodynamic Study of Sn-Ag-Ti Active Filler Metals

Published:2012 Issue: Volume:25 Page:30-35
ISSN:1875-3892
Container-title:Physics Procedia
language:en
Short-container-title:Physics Procedia

Author:

Tang Yu,Li Guoyuan

Publisher

Elsevier BV

Subject

General Engineering

Reference14 articles.

1. Determination of the Concentration of Oxygen Dissolved in the AlN Lattice by Hot Gas Extraction from AlN Ceramic;Thomas;Journal of the European Ceramic Society,1991

2. Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti (Ce, Ga) Filler;Chang;Journal of Electronic Materials,2007

3. Active soldering of Indium Tin Oxide With Cu in Air Using an Sn3.5Ag4Ti (Ce, Ga) Filler;Chang;Journal of Materials Engineering and Performance,2003

4. Interfacial Reactions of Liquid Sn and Sn-3.5Ag Solders with Ag Thick Films;Su;Journal of Materials Engineering and Performance,2002

5. Active soldering of indium-tin-oxide sputtering targets to copper backing plates using an Sn56Bi4Ti (Ce;Chang;Ga) filler metal was investigated. Welding Journal,2006

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