An Interconnect Sheet Resistance Model Considering CMP Pattern Effects in 45nm Process

Author:

Ma Tianyu,Chen Lan,Ruan Wenbiao

Publisher

Elsevier BV

Subject

General Engineering

Reference6 articles.

1. Design of IC interconnects with accurate modeling of CMP, in Proc;He;SPIE-Conf. Design Process Integration for Microelectronic Manufacturing,2005

2. Julie Segal, Chris Haidinyak, Stephen Pramme, Go Nagatani, Brandon Ward. Electrically Testable CMP Characterization Vehicle for DFM, Process Transfer, and Process Development, 2008 International Symposium on Semiconductor Manufacturing (ISSM), p. 333-336.

3. Yu Cao, and Costas J;Runzi Chang;Spanos. Modeling the Electrical Effects of Metal Dishing Due to CMP for On-Chip Interconnect Optimization, IEEE Transactions on Electron Devices,2004

4. Evaluation of sheet resistance and electrical line width measurement techniques for copper damascene interconnect;Smith;IEEE Trans. Semiconduct. Manufact.,2002

5. Mentor Graphics. Calibre CMPAnalyzer User's Manual.

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