Fabrication of thermoformable circuits by laser patterning of metallized thermoplastic foils-Reference-Cited by-同舟云学术

Fabrication of thermoformable circuits by laser patterning of metallized thermoplastic foils

Published:2010 Issue: Volume:5 Page:301-309
ISSN:1875-3892
Container-title:Physics Procedia
language:en
Short-container-title:Physics Procedia

Author:

Wojakowski Bodo,Klug Ulrich,Düsing Jan,Kling Rainer

Publisher

Elsevier BV

Subject

General Engineering

Reference13 articles.

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2. M. Hüske, J. Kickelhain, J. Mller, G. Esser, Laser Supported Activation and Additive Metallization of Thermoplasu tics for 3D-MIDs, Proceedings of the 3rd Lane 2001, 2001.

3. Unternehmensmeldung, Hermes Award zeichnet innovatives Lasersystem aus, LPKF ist diesjühriger Preistrger, a Industrieanzeiger, 2010/17, 2010.

4. 3D-MID e.V.-Informationen, LPKF mit dem Hermes Award 2010 pruümiert, Produktion von Leiterplatten und Sysa temen, 6/2010, 1372-1373, 2010.

5. J. Kellard, LPKF receives the 2010 Hermes Award, Global SMT & Packaging 20-Apr-2010, 2010.

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