Potential of thermally conductive polymers for the cooling of mechatronic parts-Reference-Cited by-同舟云学术

Potential of thermally conductive polymers for the cooling of mechatronic parts

Published:2010 Issue: Volume:5 Page:735-744
ISSN:1875-3892
Container-title:Physics Procedia
language:en
Short-container-title:Physics Procedia

Author:

Heinle C.,Drummer D.

Publisher

Elsevier BV

Subject

General Engineering

Reference20 articles.

1. Hochgefüllte Duroplaste mit definierten Eigenschaften für Elektronik und Elektrotechnik;Heinl,2002

2. J. Miller, K. McCullough, Thermally conducting Moulded Polymers; Advanced Packaging, 1999.

3. C. Heinle, D. Drummer, Thermisches Management mechatronischer Systeme mit wärmeleitenden Kunststoffen; AmE 2010 - Automotive meets Electronics, GMM-Fachtagung, 15.-16. 04.2010, Dortmund.

4. Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging;Wong;J. Appl. Polym. Sci.,1999

5. Electrically and thermally conductive nylon 6.6;King;Polym. Compos.,1999

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