SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades-Reference-Cited by-同舟云学术

SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades

Published:2012 Issue: Volume:37 Page:1009-1015
ISSN:1875-3892
Container-title:Physics Procedia
language:en
Short-container-title:Physics Procedia

Author:

Macchiolo A.,Andricek L.,Moser H.G.,Nisius R.,Richter R.H.,Weigell P.

Publisher

Elsevier BV

Subject

General Engineering

Reference10 articles.

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2. P. Ramm, A. Klumpp, R. Wieland: “3D-Integration of Integrated Circuits by Interchip Vias and Cu/Sn Solid Liquid Interdiffusion”, Proceedings 6th VLSI Packaging Workshop of Japan, Tokyo (2002).

3. P. Ramm, A. Klumpp, R. Merkel, J. Weber, R. Wieland, A. Ostmann, J. Wolf: “3D System Integration Technologies“, Proc. Materials Research Society Spring Meeting, San Francisco (2003), edited by A. J.M. McKerrow, J. Leu, O. Kraft, T. Kikkawa (Mater. Res. Soc. Proc. 766, Warrendale), pp. 3-14.

4. A. Klumpp et al., “3D-Integration of Silicon Devices: A Key Technology for Sophisticated Products”, http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=5450668, Design, Automation & Test in Europe Conference & Exhibition (DATE), 2010.

5. “Development of thin pixel sensors and a novel interconnection technology for the SLHC”;Macchiolo;Nucl. Instrum. Meth. A,2008

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1. Production and characterisation of SLID interconnected n-in-p pixel modules with 75μm thin silicon sensors;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2014-09

2. Thin n-in-p pixel sensors and the SLID-ICV vertical integration technology for the ATLAS upgrade at the HL-LHC;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2013-12