Dicing of Thin Si Wafers with a Picosecond Laser Ablation Process
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference3 articles.
1. Bovatsek J M, Patel R S. Highest-speed dicing of thin silicon wafers with nanosecond-pulse 355nm q-switched laser source using line-focus fluence optimization technique. Proc. SPIE 7585. Santa Clara, CA. 2010.
2. Masayoshi K, Naoki U, Etusji O, Ryuji S, Kazuhiro A, and Kenshi F. Advanced Dicing Technology for Semiconductor Wafer -Stealth Dicing. Semiconductor Manufacturing, VOL. 20, NO. 3, Taiwan. 2007.
3. Richerzhagen B, Industrial applications of the water-jet guided laser. The Industrial Laser User, Issue 28, Switzerland. 2003 [4] Liu J M. Simple technique for measurements of pulsed Gaussian-beam spot sizes. Optics Letters, Vol. 7, Nr. 5, 1982.
Cited by 23 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Exceeding the limits in laser materials processing by bridging additive and subtractive manufacturing with continuous wave and ultrashort pulsed lasers: manufacturing of parts with undercuts;Laser 3D Manufacturing XI;2024-03-12
2. High-speed synchrotron X-ray imaging of micro-hole formation during the ablation of grooves by ultrashort laser pulses;Procedia CIRP;2024
3. Characterization analysis of 355 nm pulsed laser cutting of 6H-SiC;The International Journal of Advanced Manufacturing Technology;2023-12-20
4. Spot arrays for uniform material ablation with ultrashort pulsed lasers;Optics & Laser Technology;2023-08
5. Towards low-temperature laser paint stripping by photochemical mechanism on CFRP substrates;Journal of Manufacturing Processes;2023-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3