Recovery of nitric acid from waste etching solution using solvent extraction

Author:

Shin Chang-Hoon,Kim Ju-Yup,Kim Jun-Young,Kim Hyun-Sang,Lee Hyang-Sook,Mohapatra Debasish,Ahn Jae-Woo,Ahn Jong-Gwan,Bae Wookeun

Publisher

Elsevier BV

Subject

Health, Toxicology and Mutagenesis,Pollution,Waste Management and Disposal,Environmental Chemistry,Environmental Engineering

Reference12 articles.

1. H.S. Kim, J.W. Ahn, J.Y. Kim, J.Y. Kim, C.H. Shin, Method for treating of etching acid waste containing phosphoric acid, acetic acid and nitric acid, Korean Patent KR50003996 (2005).

2. A basic research on the separation of mixed acid containing acetic acid and nitric acid discharged from semiconductor manufacturing process;Lee,2006

3. A study on the separation of acetic acid, nitric acid, and hydrofluoric acid from waste etching solution of Si wafer manufacturing process;Kim;J. Korean Inst. Res. Rec.,2007

4. A solvent extraction approach to recover acetic acid from mixed waste acids produced during semiconductor wafer process;Shin;J. Hazard. Mater.,2009

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