Coupled numerical analysis to investigate the heating mechanism of ultrasonic imprint lithography
Author:
Funder
Ministry of Education, Republic of Korea
Publisher
Elsevier BV
Subject
Acoustics and Ultrasonics
Reference22 articles.
1. Hot embossing precise structure onto plastic plates by ultrasonic vibration;Liu;Polym. Eng. Sci.,2005
2. Development of ultrasonic micro hot embossing technology;Mekaru;Microelectron. Eng.,2007
3. Manufacturing of polymer micro parts by ultrasonic plasticization and direct injection;Michaeli;Microsyst. Technol.,2011
4. Effects of ultrasonic vibration on the micro-molding processing of polylactide;Sacristana;Ultrason. Sonochem.,2014
5. Influence of ultrasonic vibration on micro-extrusion;Bunget;Ultrasonics,2011
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