1. Electronic Packaging and Production, Technical monitoring, Metal/Intermetalic Matrix Composites, 39, by SRI Int., 1995.
2. Lefranc G, Degischer HP, Sommer KH. Al–SiC improves reliability of IGBT power modules. Proceedings of ICCM-12, Paris 1999; p. 1335–44.
3. Simančı́k F. Factors influencing development of metal matrix composites (in Slovak). Proceedings of Konštrukčné Materiály, Bratislava, ÚMMS SAV, 1997; p. 120.
4. Thermal expansion of copper–carbon fibre composite;Štefánik;Theor Appl Fract Mech,1994
5. Thermal diffusivity of measurement using the flash technique;Parker;J Appl Phys,1961