A simulation model for assimilate partitioning between pods in pea (Pisum sativum L.) during the period of seed set; validation in field conditions
Author:
Publisher
Elsevier BV
Subject
Soil Science,Agronomy and Crop Science
Reference23 articles.
1. The mean squared error of yield prediction by soygro;Colson;Agron. J.,1994
2. Influence des stress abiotiques sur l'évolution du nombre de ramifications et de tiges chez le pois;Doré,1994
3. Seed lengths corresponding to the final stage in seed abortion of three grain legumes;Duthion;Crop Sci.,1992
4. A quantitative study of carbon transfer from pod and subtending leaf to the ripening seeds of the field pea (Pisum arvense L.);Flinn;J. Exp. Bot.,1970
5. A simulation model for the dynamics of rice growth and development: Part I. The carbon balance;Graf;Agric. Systems,1990
Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Carbon fluxes and environmental interactions during legume development, with a specific focus on Pisum sativum;Physiologia Plantarum;2022-05
2. Effect of Low Temperature on Dry Matter, Partitioning, and Seed Yield: A Review;Physiological Processes in Plants Under Low Temperature Stress;2022
3. Dry Matter Production, Partitioning, and Seed Yield Under Soil Water Deficit: A Review;Soil Water Deficit and Physiological Issues in Plants;2021
4. New approach to determine biological and environmental factors influencing mass of a single pea (Pisum sativum L.) seed in Silesia region in Poland using a CART model;European Journal of Agronomy;2016-03
5. The use of models at field and farm levels for the ex ante assessment of new pea genotypes;European Journal of Agronomy;2012-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3