Spray cooling and flash evaporation cooling: The current development and application

Author:

Cheng Wen-Long,Zhang Wei-Wei,Chen Hua,Hu Lei

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Renewable Energy, Sustainability and the Environment

Reference126 articles.

1. Comparison of two-phase electronic cooling using free jets and sprays;Estes;J Electron Packag,1995

2. Sienski K, Eden R, Schaefer D. 3-D electronic interconnect packaging. In: 1996 IEEE proceedings aerospace applications conference. IEEE; 1996. p. 363–73.

3. An experimental comparison of liquid jet array and spray impingement cooling in the non-boiling regime;Oliphant;Exp Therm Fluid Sci,1998

4. Assessment of high-heat-flux thermal management schemes;Mudawar;Compon Packag Technol IEEE Trans,2001

5. Evaluation of jet impingement, spray and microchannel chip cooling options for high heat flux removal;Kandlikar;Heat Transf Eng,2007

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