Enhanced boiling heat transfer by nano structured surfaces and nanofluids-Reference-Cited by-同舟云学术

Enhanced boiling heat transfer by nano structured surfaces and nanofluids

Published:2018-02 Issue: Volume:82 Page:4028-4043
ISSN:1364-0321
Container-title:Renewable and Sustainable Energy Reviews
language:en
Short-container-title:Renewable and Sustainable Energy Reviews

Author:

Jothi Prakash C.G.,Prasanth R.

Funder

Board of Research in Nuclear Sciences

Publisher

Elsevier BV

Subject

Renewable Energy, Sustainability and the Environment

Reference113 articles.

1. A comprehensive review on heat transfer characteristics of TiO2 nanofluids;Yang;Int J Heat Mass Transf,2017

2. Review of boiling heat transfer enhancement on micro/nanostructured surfaces;Kim;Exp Therm Fluid Sci,2015

3. Heat transfer and critical heat flux of nanofluid boiling: a comprehensive review;Fang;Renew Sust Energ Rev,2016

4. Choi S, Eastman JA. Enhancing thermal conductivity of fluids with nanoparticles. In: Developments and applications of non-Newtonian flows. ASME; 1995, 66. p. 99–105.

5. Cieslinski JT. Augmentation of critical heat flux in water-Al2O3, water-TiO2 and water-Cu nanofluids. In: MATEC Web of Conferences, EDP Sciences; 2014, 18. 801012.

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