Reliability of Microbolometer Thermal Imager Sensors Using Chip-scale Packaging

Author:

Elßner Michael,Vogt Holger

Publisher

Elsevier BV

Subject

Applied Mathematics

Reference17 articles.

1. Fraunhofer IMS, “Annual report of the Fraunhofer-Institute for microelectronic circuits and systems IMS Duisburg 2013,” 2013. [Online]. Available: http://www.ims.fraunhofer.de/fileadmin/user/presse/jahresberichte/IMS_AnnualReport2011_klein.pdf.

2. Thermal Infrared Sensors: Theory, Optimisation and Practice;Budzier;John Wiley & Sons,2011

3. Uncooled Infrared Imaging Arrays and Systems, Academic Press;Kruse;Semiconductors and semimetals,1997

4. Infrared Detectors, Second Edition;Rogalski;CRC Press,2010

5. Recent development of ultra small pixel uncooled focal plane arrays at DRS,” Proc. SPIE 6542;Li;Infrared Technology and Applications XXXIII, 65421Y,2007

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