Author:
Du Li Dong,Zhao Zhan,Xiao Li,Chen Ji Chao,Fang Zhen,Tian Qing
Reference4 articles.
1. Micromachined pressure sensors review and recent developments;Eatony;Smart Materials and Structures,1997
2. A Ag-Sn Isothermal Solidification Technology For Fluxless Hermetic Wafer Bonding;Li;Electronics Industry and Special Equipment,2007
3. D. Wang, Y. Yuan, L. Luo. Preparation of Sn-Ag-In ternary solder bumps by electroplating in sequence and Reliability. Journal of Semiconductors, 2011; 32(8): 083005.(1-6).
4. Senturia S D. Microsystem design. 2nd ed. Kluwer Academic Publishers; 2001.