Soldering of Copper with High-temperature Zn-based Solders-Reference-Cited by-同舟云学术

Soldering of Copper with High-temperature Zn-based Solders

Published:2015 Issue: Volume:100 Page:1370-1375
ISSN:1877-7058
Container-title:Procedia Engineering
language:en
Short-container-title:Procedia Engineering

Author:

Prach Michal,Koleňák Roman

Publisher

Elsevier BV

Subject

Applied Mathematics

Reference13 articles.

1. High-Temperature Lead-Free Solders: Properties and Possibilities;Suganuma;JOM,2009

2. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering;Kroupa;Journal of Materials Engineering and Performance,2012

3. Development of a Binary Zn-Based Solder Alloy for Joining Wrought Magnesium Alloy AZ31B;Ma;ASM International,2013

4. High-frequency induction soldering of magnesium alloy AZ31B using a Zn-Al filler metal;Ma;Materials Letters,2010

5. Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame;Haque;Journal of Material Science: Materials in Electronics,2012

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