Author:
Dang Wenting,Vinciguerra Vincenzo,Lorenzelli Leandro,Dahiya Ravinder
Cited by
2 articles.
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1. High-Toughness Aluminum-N-Doped Polysilicon Wiring for Flexible Electronics;2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS);2022-07-10
2. Ultra-thin chips for high-performance flexible electronics;npj Flexible Electronics;2018-03-14