Effect of a DC Field on Temperature Distribution in a Thin FGM Metal Line Subjected to Distributed Local Heating Sources

Author:

Ghosh Abhishek Kumar,Haque Md. Rejaul,Ahmed S. Reaz

Publisher

Elsevier BV

Subject

Applied Mathematics

Reference11 articles.

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2. Functional high-speed characterization and modeling of a six-layer copper wiring structure and performance comparison with aluminum on-chip interconnections;Deutsch,1998

3. Interconnect design strategy: Structures, repeaters and materials toward 0.1μm ULSI's with a giga-hertz clock operation, Tech;Takahashi;Dig. IEEE Int. Electron Devices Meeting,1998

4. Scaling effect on electromigration in on-chip Cu wiring;Hu,1999

5. Fabrication and performance limits of sub-0.1 micrometer Cu interconnects;Kuan;Proc. of Mat. Res. Soc. Symp.,2000

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