Design, fabrication of honeycomb-shaped 1–3 connectivity piezoelectric micropillar arrays for 2D ultrasound transducer application-Reference-Cited by-同舟云学术

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Design, fabrication of honeycomb-shaped 1–3 connectivity piezoelectric micropillar arrays for 2D ultrasound transducer application

Published:2020-06 Issue:8 Volume:46 Page:12023-12030
ISSN:0272-8842
Container-title:Ceramics International
language:en
Short-container-title:Ceramics International

Author:

Park Jae Man,Shin Da Seul,Han Jun Sae,Oh Joo Won,Park Sung Cheol,Kim Yong Dae,Jang Jin Man,Lee Won Sik,Park Seong Jin

Funder

Industrial Strategic Technology Development Program

Ministry of Trade, Industry & Energy

MSICT

POSTECH

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference35 articles.

1. Electrical fracture toughness for conductive cracks driven by electric fields in piezoelectric materials;Fu;Appl. Phys. Lett.,2000

2. 3D printing of piezoelectric element for energy focusing and ultrasonic sensing;Chen;Nanomater. Energy,2016

3. High-temperature piezoelectric sensing;Jiang;Sensors,2014

4. Processing and piezoelectric properties of porous PZT ceramics;Zeng;Ceram. Int.,2007

5. Modeling 1-3 composite piezoelectrics: thickness-mode oscillations;Smith;IEEE Trans. Ultrason. Ferroelectrics Freq. Contr.,1991

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