Self-reinforced and high-thermal conductivity silicon nitride by tailoring α-β phase ratio with pressureless multi-step sintering-Reference-Cited by-同舟云学术

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Self-reinforced and high-thermal conductivity silicon nitride by tailoring α-β phase ratio with pressureless multi-step sintering

Published:2021-05 Issue:9 Volume:47 Page:13057-13064
ISSN:0272-8842
Container-title:Ceramics International
language:en
Short-container-title:Ceramics International

Author:

Kong Jung Hoon,Ma Ho Jin,Jung Wook Ki,Hong Juseop,Jun Kisoo,Kim Do Kyung

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference38 articles.

1. High thermal conductivity silicon nitride ceramics;Hirao;J. Korean Ceram. Soc.,2012

2. Microstructural evolution of Si3N4 ceramics from starting powders with different α-to-β ratios;Lee;J. Ceram. Soc. Japan.,2016

3. Effects of impurity oxygen content in raw Si powder on thermal and mechanical properties of sintered reaction-bonded silicon nitrides;Kusano;Int. J. Appl. Ceram. Technol.,2012

4. Packaging technologies of power modules for hybrid electric vehicles and electric vehicles;Yamagiwa;Bull. Ceram. Soc. Japan.,2010

5. Effect of microstructure on thermal conductivity of AlN ceramics;Okamoto;J. Ceram. Soc. Japan.,1989

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2. Fabrication of Si3N4 ceramics with adjustable microstructure and mechanical properties via Y2O3 contents in ZrN–AlN–Y2O3 ternary sintering additives;Ceramics International;2024-07

3. Fabrication of silicon nitride with high thermal conductivity and flexural strength by hot‐pressing flowing sintering;International Journal of Applied Ceramic Technology;2024-03-28

4. Microstructure and mechanical properties of highly dense Si3N4 ceramics with ZrN–AlN–Re2O3 (Re=Yb, Y, Nd, Ce, La) additives;Ceramics International;2024-01

5. Synergistic Reinforcement of Si3N4 Based Ceramics Fabricated via Multiphase Strengthening under Low Temperature and Short Holding Time;Materials;2023-09-11

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