Hole characteristics and surface damage formation mechanisms of C /SiC composites machined by abrasive waterjet
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials
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1. Hole formation mechanisms in double-sided laser drilling of Ti6Al4V-C/SiC stacked materials;Journal of Materials Processing Technology;2024-04
2. In situ damage propagation and fracture in notched cross-ply SiC/SiC composites: Experiment and numerical modeling;Journal of the European Ceramic Society;2024-04
3. Effect of fiber orientation on material removal mechanisms in the machining of 3D Cf/SiC composite with a brazed diamond grinding rod: Experiment and simulation;Journal of Manufacturing Processes;2024-03
4. Experimental study on grinding 2.5D C/SiC composites by electroplated grinding wheel with ordered abrasive clusters;Diamond and Related Materials;2024-02
5. Review on Abrasive Machining Technology of SiC Ceramic Composites;Micromachines;2024-01-07
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