Experimental investigation on diamond wire sawing of Si3N4 ceramics considering the evolution of wire cutting performance-Reference-Cited by-同舟云学术

Experimental investigation on diamond wire sawing of Si3N4 ceramics considering the evolution of wire cutting performance

Published:2022-06 Issue:12 Volume:48 Page:17335-17342
ISSN:0272-8842
Container-title:Ceramics International
language:en
Short-container-title:Ceramics International

Author:

Liu Yihe,Zhu Zhenfeng

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference29 articles.

1. A study on fabrication of silicon nitride-based advanced ceramic composite materials via spark plasma sintering;Mir;P. I. Mech. Eng. L-J. Mat.,2021

2. Effect of composite sintering additives containing non-oxide on mechanical, thermal and dielectric properties of silicon nitride ceramics substrate;Hu;Ceram. Int.,2021

3. Grinding performance improvement of laser micro-structured silicon nitride ceramics by laser macro-structured diamond wheels;Zhang;Ceram. Int.,2020

4. Preparation of Si3N4 ceramics by aqueous gelcasting using non-toxic agar powder as gelling agent without cooling crosslink process;Wu;Ceram. Int.,2019

5. Development of high-thermal-conductivity silicon nitride ceramics;Zhou;J. Asian. Ceram. Soc.,2015

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Surface characteristics of precision as-cut NdFeB magnet considering diamond wire wear;Precision Engineering;2024-08

2. Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire;Materials;2024-05-02

3. Study on surface characteristics of as-sawn sapphire crystal wafer considering diamond saw wire wear;Wear;2023-10

4. Investigation of Cutting Rate of Diamond Wire Saw Machine Using Numerical Modeling;Rock Mechanics and Rock Engineering;2023-07-05

5. Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface;Materials;2023-05-09