Dielectric thermally conductive and stable poly(arylene ether nitrile) composites filled with silver nanoparticles decorated hexagonal boron nitride

Author:

Zhan Yingqing,Ren Yang,Wan Xinyi,Zhang Jieming,Zhang Shihong

Funder

Research Project of Education Department of Sichuan Province

Majorly Cultivated Project of Sci-Tech Achievements Transition

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference45 articles.

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3. Mechanical, thermal conductive and dielectrical properties of organic montmorillonite reinforced benzoxazine/cyanate ester copolymer for electronic packaging;Wang;J. Mater. Sci.: Mater. Electron.,2016

4. Fabrication and characterization of OMMt/BMI/CE composites with low dielectric properties and high thermal stability for electronic packaging;Wu;J. Mater. Sci.: Mater. Electron.,2016

5. Microstructure and properties of Al/Si/SiC composites for electronic packaging;Zhu;Trans. Nonferrous Met. Soc. China,2012

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