Estimation of the minimum material removal thickness during the polishing process of ceramic tiles by laser triangulation-Reference-Cited by-同舟云学术

Estimation of the minimum material removal thickness during the polishing process of ceramic tiles by laser triangulation

Published:2018-04 Issue:5 Volume:44 Page:4646-4652
ISSN:0272-8842
Container-title:Ceramics International
language:en
Short-container-title:Ceramics International

Author:

Soares Filho J.E.,Aurich J.C.,Sousa F.J.P.,Nascimento R.M.,Paskocimas C.A.

Funder

CAPES

SBF

MICOS

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference19 articles.

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2. Surface defects detection for ceramic tiles using image processing and morphological techniques;Elbehiery;Proc. World Acad. Sci. Eng. Technol.,2005

3. Surface defects detection for ceramic tiles using image;Mishra;Int. J. Data Warehous.,2012

4. Evolução da Superfície do Porcelanato ao Longo do Processo de Polimento;Wiggers;Cerâmica,2007

5. Polishing porcelain tile. Part 1: wear mechanism;Sánchez;Am. Ceram. Soc.,2002

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