Synthesis of SiC nano-powder from organic precursors using RF inductively coupled thermal plasma
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. Silicon carbide and silicon carbide-based structures: the physics of epitaxy;Pierre;Surf. Sci. Rep.,2002
2. Silicon carbide coating to protect carbon/carbon composites against oxidation;Fu;Scr. Mater.,2005
3. The microstructure and hardness of silicon carbide synthesized by plasma pressure compaction;Ravi;J. Alloys Compd.,2009
4. Formation of silicon carbide whiskers and their microstructure;Chrysanthou;J. Mater. Sci.,1991
5. Synthesis of silicon carbide nanopowder using silica fume;Zhong;J. Am. Ceram. Soc.,2010
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